My Cart Info:

Total Items:0

0

Contact Samtec

If you need any help feel free to:

Contact our Customer Service Department

1-800-726-8329/1-812-944-6733

Try our live chat.

 

Account Info

 
 
Create a new account...
Forgot your password?

Samtec Technical Library

TOP

Below is a list of current Samtec Articles. Click on the title to be directed to that specific Press Release or click on the download button to save a zipped PDF file to your hard drive.

DATE TITLE AUTHOR/
PUBLICATION
04/09 Samtec receives Best Product Award in Electromechanik and Connectors EE Publish Industry
12/08 Samtec, along with StackableUSB are chosen 2008 Best Electronic Design Winner for the Embedded USB Standard. SBS
12/08 USB Thinks Inside the Box SBS
11/08 Emad Soubh Interview in Test Magazine Test Magazine, Korea
09/07 Selecting cable for high-speed applications Ralph Raiola
Electronic Products Magazine
09/07 TDR and S-parameter measurements: How much performance do you need? Dima Smolyansky
Tektronix Inc
06/07 How to Simplify Hardware Prototyping with EXP Modules Jim Beneke, Avnet Programmable Logic - Design Line
02/07 Enhanced Connector Design Solves Insertion/Removal Stress Ivan Straznicky
Curtiss-Wright Controls Embedded Computing
David Givens, Samtec, Inc.
09/06 On-line Tools Work to Ease Design Efforts Microwave RF Notebook
Nancy Friedrich
10/05 Selecting Connectors for Differential Applications  Julian Ferry &
Russell Moser
Electronic Products
09/05 TDR For Differential Pair Characterization Abe Riazi
Printed Circuit Design and Manufacture
03/05 A Solution for the Design, Simulation and Validation of Board-to-Board Interconnects Julian Ferry
High Frequency Deign
02/05 Samtec Receives 2005 Design Vision Award Connector Specifier
08/04 Materially Deficient - Think your parts are green? Be prepared to prove it! Michael Kirschner
Electronic Business
09/02 Vendors spin components and subsystems
for tougher times
Martin Gold
EE Times
07/02 Connectors pushing toward data rates of 10 Gbits/s Gina Roos
EE Times
02/02 Midtier connector makers fight to survive consolidation</a> Spencer Chin
Planet Analog
07/01 BGA socket makers lob finer pitches with new processes Hailey McKeefry
EE Times
02/01 Nonlinear Analysis Helps Design
LGA Connectors
Brian Vicich
Samtec
02/01 Connector system hits 10 GHz without signal degradation Bettyann Liotta
EE Times

Below is a list of current Samtec Presentations. Click on the title to be directed to that specific Press Release or click on the download button to save a zipped PDF file to your hard drive.

DATE TITLE AUTHOR/
PUBLICATION
01/11 DesignCon 2011 - Novel Transmission Line for 40 GHz PCB Applications Jamal S. Izadian, Ph.D., RFCONNEXT, Inc.
Julian Ferry, Samtec, Inc.
Justin McAllister, Samtec, Inc.
02/10 DesignCon 2010 Quality of High Frequency Measurements Tech Forum Nadolny - Samtec, Inc.
Tom Dagostino - Teraspeed Consulting Group LLC
Yuriy Shlepnev - Simberian
Scott McMorrow - Teraspeed Consulting Group LLC
02/10 DesignCon 2010 Shielded Flex Circuitry - What Drives Performance Jim Nadolny
Julian Ferry
02/09 DesignCon 2009 RealTime interview with Julian Ferry, Samtec’s High Speed Engineering Manager. Julian Ferry, Samtec
02/09 DesignCon 2009 - Characterizing Non-Standard Impedance Channels with 50 Ohm Instruments Samtec, Inc.
Agilent Technologies, Inc.
07/08 Power Integrity Engineering
DC Power Integrity
Scott McMorrow
Samtec
02/08 DesignCon 2008 - RealTime interview with Brian Vicich on how Samtec makes the PCB designer’s job easier. Brian Vicich, Samtec
02/08 DesignCon 2008 - Pushing the Envelope without Tears: An Advanced Power Delivery Solution Steve Weir, Teraspeed Consulting
02/08 DesignCon 2008 - Test Fixturing and Measurement Methodology Emad Soubh, Samtec,Inc.
Brock LaMeres, Probing Technology
Brent Holcombe, Probing Technology
02/08 DesignCon 2008 - Mode Conversion and EMI Performance Jim Nadolny
Samtec, Inc.
12/07 Shielded Cable Assemblies & EMI Performance Jim Nadolny
Samtec, Inc.
04/07 Understanding Samtec's Electrical Circuit Simulation Models of Cable Assemblies Corey Kimble
Samtec
02/07 PCB Design Methods for Optimum FPGA SerDes Jitter Performance - DesignCon 2007 Steve Weir
Teraspeed Consulting
02/07 A New Innovation:  Connectorless Probing Enables High Speed Serial Protocol Testing - DesignCon 2007 Barbara P. Aichinger
FuturePlus Systems Corp.
01/07 Design and Application of an Optical Backplane Connection System - DesignCon 2007 Brian Vicich, Ken Hopkins,
Richard Pitwon
01/07 A Novel Procedure for Characterization of Multi-Port High Speed Balanced Devices - DesignCon 2007 Jim Nadolny
Vahe' Adamian
12/06 Link Path Modeling for SI Analysis Jim Nadolny
06/06 Cable Assembly Modeling Jim Nadolny
02/06 IBIS Connector Models: Facts vs. Fiction - DesignCon 2006 TecPreview Jim Nadolny
Corey Kimble
11/05 Advanced Edge Card Transitions Scott McMorrow
Teraspeed Consulting
09/05 Simplified Design and Modeling of Surface Mount Connector Pad Transitions for Applications at 10 to 20 Gbps NRZ Brian Vicich, Samtec,
Scott McMorrow, Teraspeed
08/05 How to Use Connector Spice Models Scott McMorrow
06/05 Understanding the Apparent Impedance of Interconnects Julian Ferry
03/05 Designing High Speed Cable Assemblies Scott McMorrow
02/05 RoHS Compliant Jan Hrouda
02/05 Final Inch® - A Plug-and-Play reference Design Solution for High Speed Interconnects Julian Ferry
12/04 High Speed Flex Circuit Design Considerations Scott McMorrow
08/04 Connector Pinout - the Art and Science of Connector Grounds Scott McMorrow
04/04 Designing High Speed Cable Assemblies Emad Soubh
04/04 Advances in Design, Modeling, Simulation and Measurement Validation of High Performance
Board-to-Board 5 to 10 Gbps Interconnects
Brian Vicich, Samtec,
Scott McMorrow, Tom Dagostino, Bob Ross, Teraspeed,
Rob Hinz, Cider Designs
02/04 Advances in Design, Modeling, Simulation and Measurement Validation of High Performance
Board-to-Board 5 to 10 Gbps Interconnects
Brian Vicich, Samtec,
Scott McMorrow, Tom Dagostino, Bob Ross, Teraspeed,
Rob Hinz, Cider Designs
11/03 Samtec Connector Models for Electrical Simulation Corey Kimble
09/03 Optimizing Flex Circuitry Glenn Menear
07/03 Final Inch® Dave Givens

Below is a list of current Samtec White Papers. Click on the title to be directed to that specific White Paper or click on the download button to save a zipped PDF file to your hard drive.

DATE TITLE AUTHOR/
PUBLICATION
RELATED
SAMTEC
PARTS
01/11 DesignCon 2011 - Novel Transmission Line for 40 GHz PCB Applications Jamal S. Izadian, Ph.D., RFCONNEXT, Inc.
Julian Ferry, Samtec, Inc.
Justin McAllister, Samtec, Inc.
06/10 Optimizing BNC PCB Footprint Designs for Digital Video Equipment Tsun-kit Chin
Applications Engineer,
National Semiconductor Corp.
BNC7T
08/09 Increasing Bandwidth and Connectivity in Small Form Factor, High-Performance Embedded Applications: The I/O-Centric, High-Speed SUMIT Interconnect Standard VersaLogic Corp  
06/09 EPLSP Series High Speed I/O Cable Assembly, Equalized Cable Assembly, 3 Meter Length, 6.25 Gbps Performance Reference Design Samtec/Teraspeed EPLSP
04/09 RF Characterization of 2.45 GHz Antenna Assembly with Integrated Feedline Samtec, Inc. MMCX-EM
04/09 HapsTrak II standard Jonas Magnusson, Synplicity, Inc.  
03/09 Transformation of Samtec Connector Test Data For 85 ohm Differential Impedance Applications for RU8 Samtec, Inc. RU8
02/09 DesignCon 2009 - Characterizing Non-Standard Impedance Channels with 50 Ohm Instruments Samtec, Inc.
Agilent Technologies, Inc.
 
02/09 85 ohm ERDL2 Flex Assembly Samtec, Inc.  
02/08 Power Testing Standards White Paper Samtec, Inc.  
01/08 Samtec Standard Cable Shielding Performance Samtec
Jim Nadolny,
Cesar Arroyo
 
10/07 Understanding Voltage and Power Ratings David Scopelitti
D-Scope-Tech Inc.
 
09/07 HFEM-SE High Speed Flex Data Link SPICE Model Validation Report Kieran Kelly HFEM-SE
QTE / QSE
08/07 Linear vs. Non-Linear Contact Analysis Brian Vicich, Craig Ryan,
Kevin Meredith,
Samtec
 
08/07 Solectron HD Mezz Connector Processing Trial SMT Assembly Report Samtec,
Solectron, Molex,
HDAM/HDAF
08/07 EMI Design of Shielded Cable Assemblies IEEE, Jim Nadolny
Samtec, Inc.
 
08/07 Contact Plating Effects on Signal Integrity – QTE-028-07-L-D-DP-A Mated with QSE-028-01-L-D-DP-A Corey Kimble
Samtec
QTE-DP,
QSE-DP
08/07 Contact Plating Effects on Signal Integrity – QTE-020-07-L-D-A Mated With QSE-020-01-L-D-A Corey Kimble
Samtec
QSE, QTE
08/07 Contact Plating Effects on Signal Integrity – QTE-028-01-L-D-DP-A Mated With QSE-028-01-L-D-DP-A Corey Kimble
Samtec
QTE-DP,
QSE-DP
08/07 Contact Plating Effects on Signal Integrity – QTE-020-01-L-D-A Mated With QSE-020-01-L-D-A Corey Kimble
Samtec
QSE, QTE
06/07 Ribbon Cable Assembly Comparision Summary Jim Nadolny & Justin McAllister, Samtec, Inc. FFSD
FFTP<
05/07 The Development and Verification of Mixed Potential Integral Equation Field Solvers in Electromagnetics J. Rodgers
K. Chuang
 
05/07 Lubricant use in Connector Systems Improves Cycles and Wear Brian Vicich,
Samtec, Inc.
 
04/07 A Comparison of the Edge Rate vs. Stamped/Cut Contact Samtec HSEC8-DV/MEC8-DV
08/06 A Novel Procedure for Characterization of Multiport High-Speed Balanced Devices Vahe' Adamian
Brad Cole
Ultrimetrix
HDAM/HDAF
06/06 Hardware specification for Rocket-IO Serial Link (RSL) Sundance QTE-DP/QSE-DP
HFEM2-DP/HFEM-DP
EQDP
01/06 Using the Agilent Physical Layer Test System (PLTS) For Acquiring Time Domain Data Samtec QTE-DP,
QSE-DP
01/06 Universal LVDS Ribbon Cable Marc Defossez,
Xilinx, Inc.
QSE,
QTE,
QTE-DP,
QSE-DP,
EQCD,
EQDP
12/05 Lead-Contamination in Lead-Free Electronic Assembly AIM, Inc.  
12/05 TDR for Differential Pair Characterization Abe Riazi,
Interconnect Strategies
 
12/05 TI Connecting ADS8410/13 with Long Cable Bhaskar Goswami,
Rajiv Mantri
Texas Instruments
 
EQCD
11/05 Virtex-4 Source-Synchronous Interfaces Tool Kit David Naylor
Xilinx, Inc., Xcell Journal
QSE-DP
QSE
11/05 Selecting Connectors for Multi-Gigabit Transceiver Designs Marc Defossez
Xilinx, Inc., Xcell Journal
QSE/QTE,
YFS/ YFT
10/05 RocketIO MGTs with High-Speed Samtec QTE/QSE Connectors and EQCD-EQDP Cable Assemblies XILINX QSE, QTE,
QTE-DP ,
QSE-DP ,
EQCD , EQDP
09/05 TDR for Differential Pair Characterization - Part 1 Abe Riazi
Interconnect Strategies
 
08/05 Dynamic Range Determination and S-Parameter Accuracy Validation For High Frequency Time Domain Network Analyzer (TDNA) Measurements Tom Custer  
07/05 Comparison of Eye Patterns Generated by Synopsys HSPICE and the Agilent PLTS Jim Nadolny  
07/05 EQCD High Data Rate Cable Assembly Spice Model Validation Report Kieran Kelly EQCD
QSE/QTE
01/05 Part 1 - Golden Standard Overview Julian Ferry, Dan Piscotty, Samtec
Dr. Richard Elco,
Independent Consultant
 
01/05 Part 2 - Golden Standard Transmission Line Theory Julian Ferry, Dan Piscotty, Samtec
Dr. Richard Elco, Independent Consultant
 
01/05 High Speed MMCX Competitive Comparison Report Samtec  
11/04 Supplemental high Speed Characterization Report - Fold Comparison Report - HFEM2-014-T-05-00-DP Samtec HFEM2-DP
06/04 Comparison of Vector Network Analyzer and TDA Systems IConnect® Generated S-Parameters Kieran Kelly EQCD
06/04 HFEM Series -- Copper Shield and Silver-Ink Shield Kieran Kelly, Samtec
Russ Moser,
The Orion Group
HFEM-DP
HFEM-SE
01/04 Flex Characterization Scott McMorrow
Teraspeed
HFEM-DP
HEFM-SE

Click on the title to be directed to that specific Application Note.

Click on the download button if you would like to save a zipped PDF file to your hard drive.

DATE TITLE INDUSTRY
STANDARD
AUTHOR/
PUBLICATION
RELATED
SAMTEC
PARTS
08/09 MECT Series Final Inch® Designs in SFP+ Applications SFP/Xenpak/XPF Samtec/
Teraspeed
MECT
04/09 3G SDI Evaluation Board for Broadcast video market Television/
Digital Cinema
Samtec/
BrioConcept Consulting/
Gennum Corp.
BNC7T-TH
HSEC8-EM
02/09 PCIEC Series Extender Cable Assembly 1meter Assembly Length Final Inch™ Designs in PCI Express Applications Generation 2 - 5.0 Gbps PCI Express Samtec/
Teraspeed
PCIEC
02/09 Q2™ QMS/QFS 16mm Stack Height Final Inch ™ Designs in PCI Express Applications,
Generation 2 - 5.0 Gbps
PCI Express Samtec/
Teraspeed
QMS/QFS
02/09 Q Pairs® QTE-DP/QSE-DP 16mm Stack Height Final Inch™ Designs in PCI Express Applications Generation 2 - 5.0 Gbps PCI Express Samtec/
Teraspeed
QTE-DP/QSE-DP
02/09 Q Pairs® QTH-DP/QSH-DP 16mm Stack Height Final Inch™ Designs in PCI Express Applications Generation 2 - 5.0 Gbps PCI Express Samtec/
Teraspeed
QTH-DP/QSH-DP
02/09 RiseUp™ RU8 Series 30mm Stack height Final inch™ Designs in PCI Express Applications Generation 2 - 5.0 Gbps PCI Express Samtec/
Teraspeed
RU8
01/08 Edge Rate ERM8/ERF8 Series,10mm Stack Height, Final Inch Design in PCI Express, Generation 2 PCI Express Samtec/
Teraspeed
ERM8/ERF8
12/07 SEARAY™ SEAM/SEAF Series, 7mm Stack Height, Final Inch Design in PCI Express, Generation 2 PCI Express Samtec/
Teraspeed
SEAM/SEAF
02/07 PCIE Series Final Inch® Designs in PCI Express Applications Generation 1 - 2.5 Gbps PCI Express Samtec/
Teraspeed
PCIE
02/07 PCIE Series Final Inch® Designs in PCI Express Applications Generation 2 - 5.0 Gbps PCI Express Samtec/
Teraspeed
PCIE
07/05 Q Strip® QTE/QSE Series 16mm Stack Height Final Inch® Designs in Xaui Applications XAUI Samtec/
Teraspeed
QTE
QSE
03/05 RiseUp® RU8-DP-DV Series 19mm Stack Height Final Inch® Designs in PCI Express Applications PCI
Express
Samtec/
Teraspeed
RU8-DP-DV
03/05 RiseUp® RU8-DP-DV Series 25mm Stack Height Final Inch® Designs in in PCI Express Applications PCI
Express
Samtec/
Teraspeed
RU8-DP-DV
03/05 RiseUp® RU8-DP-DV Series 19mm Stack Height Final Inch® Designs in Serial ATA Generation 1 Applications SATA Samtec/
Teraspeed
RU8-DP-DV
03/05 RiseUp® RU8-DP-DV Series 25mm Stack Height Final Inch® Designs in Serial ATA Generation 1 Applications SATA Samtec/
Teraspeed
RU8-DP-DV
03/05 RiseUp® RU8-DP-DV Series 19mm Stack Height Final Inch® Designs in XAUI Applications XAUI Samtec/
Teraspeed
RU8-DP-DV
03/05 RiseUp® RU8-DP-DV Series 25mm Stack Height Final Inch Designs in XAUI Applications XAUI Samtec/
Teraspeed
RU8-DP-DV
02/05 Q2™ QMS-DP/QFS-DP Series 11mm Stack Height Final Inch® Designs in XAUI Applications XAUI Samtec/
Teraspeed
QMS-DP
QFS-DP
02/05 Q2™ QMS-DP/QFS-DP Series 11mm Stack Height Final Inch® Designs in Serial ATA Generation 1 Applications SATA Samtec/
Teraspeed
QMS-DP
QFS-DP
01/05 Coorelation Report Q Pairs® QTE-DP/QSE-DP and DP Array™ DPAM/DPAF Final Inch® SPICE Simulations vs. Lab Measurements with the Xilinx™ RocketIO® Evaluation Board SPICE
XILINX
Samtec/
Teraspeed
DPAM
DPAF
QTE-DP
QSE-DP
01/05 Q2™ QMS-DP/QFS-DP Final Inch® Designs in PCI Express Applications 11mm Stack Height PCI
Express
Samtec/
Teraspeed
QMS-DP
QFS-DP
01/05 DP Array™ DPAM/DPAF Final Inch® Designs in XAUI Applications 10mm Stack Height XAUI Samtec/
Teraspeed
DPAM
DPAF
01/05 DP Array™ DPAM/DPAF Final Inch® Designs in Serial ATA Generation 1 Applicaitons 10mm Stack Height SATA Samtec/
Teraspeed
DPAM
DPAF
01/05 DP Array™ DPAM/DPAF Final inch® Designs in PCI Express Applications 10mm Stack Height PCI
Express
Samtec/
Teraspeed
DPAM
DPAF
01/05 SEARAY™ SEAM/SEAF Final Inch™ Designs in RapidIO Short Run (Mezzanine) Applications 7mm Stack Height Rapid
IO
Samtec/
Teraspeed
SEAM/
SEAF
10/04 Q Pairs® QTE-DP/QSE-DP Multi-Connector Stack Designs in PCI Express Applications 16mm Connector Stack Height PCI
Express
Samtec/
Teraspeed
QTE-DP
QSE-DP
09/04 Q Pairs® QTH-DP/QSH-DP Final Inch™
Designs In Serial ATA Generation 1 Applications
5mm Stack Height
SATA Samtec/
Teraspeed
QTH-DP
QSH-DP
09/04 DP Array™ Final Inch™ Designs in Rapid IO Short Run (Mezzanine) Applications 10mm Stack Height RAPID
IO
Samtec/
Teraspeed
DPAM
DPAF
09/04 Q Pairs® QTH-DP/QSH-DP Final Inch™
Designs In XAUI Applications
5mm Stack Height
XAUI Samtec/
Teraspeed
QTH-DP
QSH-DP
09/04 Q Pairs® QTH/QSH-DP Final Inch™
Designs In PCI Express Applications
5 mm Stack Height
PCI
Express
Samtec/
Teraspeed
QTH-DP
QSH-DP
08/04 Q Pairs® QTE/QSE-DP Final Inch™ Designs In Serial ATA Generation 1 Applications 5mm Stack Height SATA Samtec/
Teraspeed
QTE-DP
QSE-DP
07/04 SamArray® YFT/YFS Final Inch™
Designs in RapidIO Short Run (Mezzanine)
Applications XMC Connector 10mm Stack Height
RAPID
IO
Samtec/
Teraspeed
ASP-105885-01
ASP-105884-01
06/04 Q Pairs ® Final Inch™ in PCI Express Applications with 16mm Stack Height PCI
Express
Samtec/
Teraspeed
QTE-DP
QSE-DP
06/04 Q Pairs® QTE/QSE-DP Final Inch(tm)™ Designs in XAUI Applications 5mm Stack Height XAUI Samtec/
Teraspeed
QTE-DP
QSE-DP
05/04 Q Pairs® QTE/QSE-DP Final Inch™ Designs In PCI Express Applications 5mm Stack Height PCI
Express
Samtec/
Teraspeed
QTE-DP
QSE-DP

Enter a competitor part number to return a list of similar Samtec products.

close